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Mechanic Reflow Soldering Heating Platform , US Plug, Reflow (US Plug), Reflow (EU Plug)
1. Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation 2. Especially for the...
- £ 194.99 GBP
- £ 194.99 GBP
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Vendor: MECHANIC
Mechanic Reflow Soldering Heating Platform , US Plug, Reflow (US Plug), Reflow (EU Plug)
£ 194.99 GBP
Vendor: MECHANIC
Mechanic Reflow Soldering Heating Platform , US Plug, Reflow (US Plug), Reflow (EU Plug)
£ 194.99 GBP
Our Business Identity & Customer Commitment We are committed to maintaining full transparency in our business practices to ensure a seamless and trustworthy shopping experience for all our customers. Below, we outline key aspects of our operations and policies: ..
- Shipping Origin:
- All products are shipped directly from our warehouse. We shall keep up to date at every level from processing until successfully delivered.
- Order Tracking:
- Every shipment (100% of orders) comes with full tracking to keep you updated on the progress of your delivery.
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1. Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation
2. Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow
3. The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance
4. 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily
5. 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode
6. Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat
7. Monitor temperature changes and realize reflow soldering temperature curve data monitoring
8. Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
9. Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
2. Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow
3. The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance
4. 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily
5. 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode
6. Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat
7. Monitor temperature changes and realize reflow soldering temperature curve data monitoring
8. Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
9. Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
Specification:
| Package Weight |
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| Product Assurance | We take great care in ensuring that all our products meet quality standards and are packaged securely for safe delivery. |
| Requirement Analysis | performance benchmarks |
| Manufacturing & Production Control | Implemented quality checks during production |
| Compliance | Keeping up with evolving regulations. |
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